In the wake of the company's announcement to recruit over 3,000 new personnel, Taiwanese leading contract chipmaker TSMC (Taiwan Semiconductor Manufacturing Corporation) recently completed the installation of Phase 5 facilities at its 30-mm fab, dubbed Fab 12, in Hsinchu, Taiwan's Commercial Times reported on January 20. TSMC's Phase 4 and Phase 5 facilities, comprising a total of 4,500 personnel, have exclusively engaged in the R&D of advanced chip technologies and in initial volume production. TSMC stated that its Phase 5 facilities at Fab 12 will conduct R&D for 22nm and more advance process technologies and will begin 28nm mass production in the third quarter of 2010. TSMC's Phase 4 facilities already kicked off mass production in the third quarter of 2009. Meanwhile, TSMC also plans to boost its R&D expenses to approximately NT$27.0 billion (US$846.4 million; US$1 = NT$31.9) in 2010, a 25% increase from the previous year of 21.6 billion (US$677.1 million).